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Complex thermal shielding

Complex thermal shielding of memory card is standardized locked “joint-to-joint” parts of active and passive protection, based on nanostructured compounds of chemical and mineral substances and fibers.

Complex thermal shielding (weight 150…170 g) works in ZMP-K-02 unit (volume 0,25…0,35) dm³.

Protected memory module ZMP-K-02 and memory card
Protected memory module ZMP-K-02 and memory card
Molded parts of active and passive thermal protection in body of ZMP-K-02
Molded parts of active and passive thermal protection in body of ZMP-K-02

Active protection:

  • Solid dispersed heat-absorbing chemical compounds with enthalpy (E) more than 2000 J/g.

Passive protection:

  • Volume density: 150...200 kg/m³.
  • Coefficient of heat conduction (40°Ń...700°Ń): 0,009-0,004 W/mK.
  • Category temperature range: from -60°Ń up to +1100°Ń.
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